In the field of SMT assembly processing, different encapsulation types often face different quality challenges. Based on practical production experience, Charmhigh Electromechanical will discuss the common encapsulation issues and causes in SMT assembly processing. The following points cover the most problematic encapsulation types and their common causes. Interested parties are invited to learn more about them.
Firstly, the most common issues with QFN encapsulation are bridging and poor soldering. These are mainly caused by poor solder paste printing, especially for components with fine pitches, where even minor printing deviations can lead to these problems.
For dense-pin components such as SOP QFP with pitches below 0.65mm, there is also a risk of bridging and poor soldering. These components have small pin spacing and high welding difficulty, making them prone to quality issues if not handled carefully.
Large pitch and large-size BGA are prone to solder joint stress fractures. This is primarily due to the BGA encapsulation's susceptibility to moisture during the welding process, which reduces the solder joint strength and leads to fractures under stress.
The issue of bridging and poor soldering in small pitch BGA cannot be ignored, and the main reason is also poor solder paste printing.
Long, fine-pitch surface-mount connectors are prone to bridging and open soldering during welding. This is mainly due to the inconsistency between PCB welding deformation and the layout direction of the sockets, causing stress during the welding process and affecting the welding quality.
The issue of rosin entering the interior of micro switches and sockets is mainly caused by the capillary effect formed by the structural design of the components. Rosin easily enters the interior of the components through tiny gaps during the welding process, affecting their performance.
To address these issues, SMT factories need to strictly control the welding process, optimize welding parameters, and improve welding quality. At the same time, they should strengthen the inspection and screening of components to ensure that the components used meet quality requirements.
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