The Art of Manual Soldering for Surface Mount Technology (SMT) Patch Processing with Non-Leaded Chip Components

In the field of SMT patch processing, manual soldering of non-leaded chip components is a task that requires both skill and delicate operation.

These components have various welding methods, and today Charmhigh Machinery and Electronics will introduce three commonly used techniques: soldering each pad individually, using specialized tools, and soldering with a flat-blade soldering tip for rapid SMT patch welding.

Individual Pad Soldering Method

This method requires operators to precisely place the component in the center of the solder pad using tweezers, and apply a small amount of flux to both ends of the solder pad using a fine brush or flux pen. Then, using a chisel-shaped (spade-shaped) soldering tip, a small amount of solder wire with a diameter of 0.5mm or less is added. The solder wire should be quickly withdrawn when it touches the soldering tip, as too much solder can be added otherwise. The soldering tip is first used to heat one end of the solder pad for approximately 2-3 seconds, and then the soldering iron is withdrawn. The same method is then used to heat the other end of the solder pad for approximately 2 seconds before withdrawing the soldering iron. It is important to note that the component should remain in close contact with the solder pad throughout the soldering process to prevent it from lifting.

Soldering with a Horseshoe-shaped Soldering Tip

This method utilizes a special horseshoe-shaped soldering tip that can simultaneously heat both ends of the solder pad, greatly improving soldering efficiency. Before soldering, flux is applied and the component is fixed in place. Then, the horseshoe-shaped soldering tip is used to quickly heat the solder pads, ensuring even and full solder joints. This method is suitable for batch production and can increase work efficiency.

Rapid Soldering with a Flat-blade Soldering Tip

This method uses a fan-shaped soldering tip to simultaneously heat both ends of the solder pad from the side of the component, achieving extremely fast soldering speeds. During operation, it is important to control the temperature and heating time of the soldering tip to prevent damage to the solder pad or component. This method is suitable for applications where soldering speed is critical.

In conclusion, manual soldering for non-leaded chip components is an essential part of SMT patch processing. By selecting the appropriate soldering method and technique, we can ensure soldering quality and efficiency, laying a solid foundation for product reliability and stability. In practical operations, we should choose the most suitable soldering method based on product requirements and process specifications, and continuously improve our soldering skills.

Hunan Charmhigh Machinery and Electronics is a professional manufacturer of SMT placement machines. If you have a need for SMT placement machine purchases, please contact us, and we will provide you with efficient and professional services. If you wish to become our local distributor, we will provide you with mutually beneficial agency programs.WhatsApp : +8618100733752 / WeChat : 86 18100733752 / Skype : 86 18100733752